High-temperature vacuum annealing for planar substrates, up to 1000 °C, with precision gas and pressure control—all in a benchtop package.
ANNEAL vacuum annealing systems from Moorfield are optimised for the thermal treatment of 2D materials and wafers under controlled atmospheres.
Optimised for the thermal treatment of 2D materials and wafers under controlled atmospheres
Substrates are supported face-up on stage-top platens that are situated centrally inside a stainless-steel high-vacuum chamber fitted with appropriate heat shielding and a shuttered viewport. Heating is via a heat source located beneath the platen. Maximum temperatures up to 1000 °C are possible—depending on the heating technology used.